Functional additives

Epoxy Resin Curing Agent

GHF2250 (CAS No. 9003-35-4,Formula:(C8H6O2)n) is a low-temperature fast-curing phenolic epoxy hardenner that delivers excellent heat resistance, mechanical strength, chemical corrosion resistance, stable electrical performance, flame retardancy, and outstanding flow properties – all while enabling energy-efficient processing through rapid curing at lower temperatures.

  • Chemical Name :

    Epoxy Resin Curing Agent
  • Application :

    Epoxy Resin Powder Coatings
  • Product model :

    GHF2250
  • Appearance :

    White or pale-yellow transparent granule/powder

GHF2250 is an innovative epoxy curing agent newly developed by China AAB Industry Technology Group. Designed for epoxy resin systems, it initiates cross-linking reactions with epoxy groups to transform liquid or thermoplastic resins into solid materials with enhanced strength and performance. Derived from a unique phenolic resin structure, it is particularly suitable for demanding applications in electronics, automotive coatings, and industrial systems where both high performance and production efficiency are essential.

 

Technical data

GHF2250

Test Method

Specification

Appearance

Visualization

White or pale-yellow transparent granule/powder

Softening point

GB/T 9284.1-2015

80~90℃

Phenolic Hydroxyl Equivalent

GB/T 31412-2015

230~250 gleq

Solid Content

GB/T 1725-2007

99.0%min

 
 

Our Epoxy Curing Agent Advantages

  • Excellent heat resistance: high glass transition temperature (Tg)
  • Good mechanical properties: high hardness and superior strength
  • Outstanding chemical resistance: excellent resistance to acids and solvents
  • Stable electrical performance: suitable for electronic and electrical applications
  • Low curing shrinkage and good dimensional stability
  • Excellent flame retardancy
  • Superior flowability

 

Typical Applications:

  • Industrial anti-corrosion and heavy-duty coating fields
  • High-temperature resistant coatings and potting materials
  • Electronic packaging materials: Core curing agent for die attach adhesives, underfill materials, and molding compounds
  • High-temperature resistant adhesives and coatings: Used in engines, brake pads, petrochemical equipment, and other applications requiring long-term heat and corrosion resistance
  • Composite and structural materials: Such as aerospace composites
  • High-performance laminates: Manufacturing high-frequency copper-clad laminates and high-Tg copper-clad laminates for high-end electronic equipment such as 5G communication devices and servers

epoxy curing agent

Packaging and Storage:

Available in polyethylene-lined,multiply paper bags, N.W.25KGS/Bag    

Keep  in  the  cool  and  dry  place, keep  away  from  fire  and  heat. Seal the package well after using.

 
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