Anti-settling Agent for silver copper nickel paste

Kabasph series of additives are developed for electronic paste systems, including conductive silver pastes, copper pastes, aluminum pastes, and thick-film materials. Our Additives solutions focuses on excellent nanoparticle dispersion, stable rheological properties, and anti-settling performance for high-density metal fillers. The portfolio covers general-purpose nano filler dispersion, carbon black and graphite wetting, inorganic nano-filler dispersion, and high specific gravity filler anti-settling.